Emhlabeni ogcwele ukukhiqizwa kwe-elekthronikhi, lapho ukucaciswa kwezinga le-micron kuchaza impumelelo, ukwethulwa kwe-Next-Gen PCB Board Drill Bits kumayelana ne-Quantum Leap e-Circuit Board Facrication. Kuthuthukiswe ukumba, ukubhala, kanye nokufaka ama-micromachining kumabhodi wesifunda aphrintiwe (ama-PCB) nezinye izingxenye ezimbalwa ze-Ultra-mncane, le nsimbi ethe xaxaI-PCB ye-Mini DrillAmathuluzi ahlanganisa izinto ze-Aerospace-grade ezinobuchwepheshe bokuqina bokuqina ukuze uphinde usebenze kahle kanye nokuphila isikhathi eside ekukhiqizweni kwevolumu ephezulu.
Ubunjiniyela Bokuhleleka: Kungani kubalulekile izindaba zensimbi
Enhliziyweni yalezi zingcezu zokumba izihlakala zilele i-tungsten Carbide ephezulu (WC), okukhethiwe okukhethiwe kokuhlanganiswa kwayo okungenakuqhathaniswa (HRA 92), gqoka ukumelana nobuqotho. Ngokungafani ne-HSS evamile (i-speed-speed speed), lo mfanekiso wensimbi we-tungsten enikezela:
I-3X ende yokuphila ye-LifeSpan: Ibekezelela imijikelezo yokumba eyi-15,000 + kumabhodi we-FR-4 ama-Fiberglass ngaphandle kokuwohloka okunqenqemeni.
Isakhiwo se-Micro-Grain Sand: Sub-0.5μm carbide okusanhlamvu kuqinisekisa imiphetho yokusika ebukhali, ukufeza amamitha omgodi omncane njenge-0.1mm ngokubekezelelana okungu-0,005mm.
I-Anti-Fracture Design: Ukuqiniswa kwe-shank geometry kuvimbela ukuqhekeka ngesikhathi sokusebenza okuphezulu kwe-RPM (30,000-60,000), ngisho nasezintweni ezigcwaliswe nge-PCB ezigcwaliswe ngobuciko be-PCB.
Ukuhlolwa kweqembu lesithathu ngesikhungo seCentcising Institute of Technology kuqinisekisa lezi zingcezu zokugcina lezi zimbobo ze-ra 0.8μm ngemuva kokuphela kwezimbobo eziyi-10,000 - into ebucayi bokuthembeka kwesiginali esiphakeme kumadivayisi we-5G kanye ne-IOT.
Ukuqina kwesifungo: Ukusika ngaphandle kokuyekethisa
I-PCB Drilling ifuna ukuqina ngokuphelele ukuvikela "ukuhamba" noma umgodi wokuhlanza umzimba. Idizayini ye-pasthic blade blade edged ibhekana nalokhu:
I-Asymmetric Flute Geometry: Izilinganiso Ukuphuma kokuphuma kanye nokudlidliza, kunciphisa amabutho alandela ama-40%.
I-Nano-camera's Helix Angle: I-Helveli engu-30 ° enama-tialn coating inciphisa ukwakha ukushisa (<70 ° C) ngesikhathi sokusebenza okuqhubekayo.
I-anti-resoon ama-grooves: ama-laser-etched micro-iziteshi ezincane ziphazamisa imvamisa ye-harmonic, ukuqinisekisa ukunemba okulinganiselayo ngaphakathi kwama-5μM kuwo wonke ama-PCB angezansi.
Ekuhlolweni kokuhlolwa kwengcindezelo engu-0.3mm ngamabhodi we-2mm aluminium-clad, lezi zingcezu zikhombise ukuphambuka kwe-zero ngaphezulu kwama-500 ngokulandelana - i-feat ayinakwa ngabancintisana.
Izicelo kuyo yonke imboni
Ama-elekthronikhi abathengi
Kwabakhiqizi bebhodi le-smartphone:
I-0.2mm Micro-Vias: Itholakale amanani entengo angu-99.9% kumabhodi we-HDI ayi-12.
Amanani okuphakelwa kwemali okusheshayo okusheshayo: Kunikwe amandla ngokungqubuzana okuncishisiwe kanye nokuvalwa kwe-chip.
Izithuthi Zokwe-Electronive
Ku-EV Power module Production:
Ukuthenjwa kwe-Shole: Kugcinwe ukuqhubeka kukagesi kagesi ku-1.6mm-nyama-nye yokuphamba okushisayo.
Ukusebenza kwamahhala okupholile: Amandla okumba owomile agwema ukungcoliswa kwezinhlelo ezivalekile ukuphathwa kwebhethri.
I-Aerospace & Defense
Ukushayela izimbobo ezi-0,15mm ku-polymide flex circuits:
I-Zero Delamination: Ngisho nase-200 ° C HIPPERENITY ENDS EVERNOC ENDLELA.
I-EMI Shield Patterning: Ukunemba okubhalwe phansi kwezendlalelo zokuvikela i-graphu.
Ukucaciswa kobuchwepheshe
Ububanzi obubanzi: 0.1mm-3.175mm (0.004 "-1/8")
Uhlobo lwe-SHANK: Okujwayelekile 3.175mm (1/8 ") noma ukuhambisana ngokwezifiso
Izinketho ze-coating: Tin (igolide), i-ticn (eluhlaza okwesibhakabhaka), noma i-carbon-efana ne-carbon (DLC)
I-MAX RPM: 80,000 (kuncike kububanzi)
Ukuvumelana: Imishini yokushayela ye-CNC, imishini yokushayela ye-PCB ezenzakalelayo, amathuluzi ajikelezayo aphathwa ngesandla
Ukusebenza kwezindleko kudalwe kabusha
Ukuhlaziywa kwezindleko-inzuzo nge-PCB ehamba phambili ye-PCB ye-TAIWANESE kuveziwe:
Ukulondolozwa konyaka yonyaka: Ukufakwa esikhundleni se-Drill kancane (kusuka ku-12 kuye ku-4 amasethi / unyaka).
Ukuncishiswa kwamandla ngo-15%: Izidingo eziphansi ze-torque eziphansi.
I-Zero Rework: Kuqedwe ama- $ 220k / ngonyaka kumabhodi acashuniwe kusuka e-Drill Worker.
Ukuqina okwakhiwe ngaphakathi
Ukuhlanganiswa kabusha kwe-Recycluble: Amathileyi we-100% we-biodegradable foodegrable.
I-ROHs & Finyelela Ukuhambisana: Mahhala Kusuka ku-Lead, Cadmium, nezinye izinto eziyingozi.
I-Extended Tool Life: 60% i-Tungsten ukusetshenziswa vs driver standard standard.
Ubufakazi Bomsebenzisi
"Ukushintshela kulezi zingcezu zensimbi ethempeli kwakuguqukayo," kusho uHiroshi Tanaka, Umphathi Wokukhiqiza kumeluleki we-Kyoto-based Kyoto-based Sensor Manzi. "Sigaye izimbobo ezingama-20,000 shift nge-cha shintsha ngaphandle kwezinguquko - okuthile okungacatshangwa ngokushayela kwethu okudala kwe-HSS. Umklamo wokuzamazama komhlaba wenqamula nge-95%."
Kungani ukhethe lezi zingcezu ze-PCB Board Drill?
Ukunemba okungenakugwenywa: ngokunemba kwe-laser-like ku-High-density InterConnect (HDI) Boards.
Ijubane ngaphandle komhlatshelo: Drill 0.3mm izimbobo ezimbozweni ezingama-400 / Minute ngaphandle kokuyekethisa ikhwalithi yomkhawulo.
Ukuvumelana kwe-Universal: kusebenza nge-FR-4, Rogers, i-Aluminium, kanye nama-laminate aqiniswe ngengilazi.
Idizayini yesikhathi esizayo
Ukugcina
Embonini lapho wonke ama-micron asho inzuzo nokusebenza, le nsimbi ethe xaxaI-PCB Board Drill Bitszingaphezu kwamathuluzi - bayithuba elihle. Ngokuhlanganisa isayensi yezinto ezibonakalayo ngobunjiniyela bokuqina, bahlomisa abakhiqizi ukuthi baphoqelele imikhawulo ye-miniaturization ngenkathi beshaya
Isikhathi sePosi: Mar-21-2025
