Emhlabeni osheshayo wokukhiqiza izinto zikagesi, lapho ukunemba kwezinga le-micron kuchaza impumelelo, ukwethulwa kwe-Next-Gen PCB Board Drill Bits kuphawula ukweqa kwe-quantum ekwenziweni kwebhodi lesekethe. Eyakhelwe ukubhola, ukuqopha, kanye ne-micromachining kumabhodi esekethe aphrintiwe (ama-PCB) namanye ama-substrates amancane kakhulu, lezi Tungsten SteelI-Mini Drill PCBAmathuluzi ahlanganisa izinto zebanga le-aerospace nobuchwepheshe bokuzinza kokuzamazama komhlaba ukuze kuchazwe kabusha ukusebenza kahle nokuphila isikhathi eside ekukhiqizweni kwevolumu ephezulu.
Ubuhle Bobunjiniyela: Kungani I-Tungsten Steel Ibalulekile
Enhliziyweni yalezi zingcezu zokubhoboza kukhona i-high-purity tungsten carbide (WC), into ekhethelwe ukuhlangana kwayo okungenakuqhathaniswa kokuqina (HRA 92), ukumelana nokugqokwa, kanye nobuqotho besakhiwo. Ngokungafani nokubhoboza okujwayelekile kwe-HSS (High-Speed Steel), lokhu kwakhiwa kwensimbi ye-tungsten kuletha:
3X Ubude besikhathi eside bempilo: Imelana nemijikelezo yokumba engu-15,000+ kumabhodi e-fiberglass e-FR-4 ngaphandle kokuwohloka komkhawulo.
Isakhiwo Sokusanhlamvu Okuncane: Izinhlamvu ze-carbide ezingaphansi kwe-0.5µm ziqinisekisa imiphetho yokusika insingo ebukhali, ifinyelela amadayamitha embobo amancane njengo-0.1mm ngokubekezelela okungu-±0.005mm.
I-Anti-Fracture Design: Ijometri ye-shank eqinisiwe ivimbela ukuphuka ngesikhathi sokusebenza okuphezulu kwe-RPM (30,000–60,000), ngisho nasezintweni ze-PCB ezigcwele i-ceramic.
Ukuhlolwa kwezinkampani zangaphandle okwenziwa yi-Precision Machining Institute of Technology kuqinisekisa ukuthi lezi zingcezu zigcina i-Ra 0.8µm iqedelela ngemuva kwezimbobo ezingu-10,000 - into ebalulekile yobuqotho besignali yemvamisa ephezulu kumadivayisi e-5G nawe-IoT.
Ukuzinza Kwe-Seismic: Ukusika Ngaphandle Kokuyekethisa
Ukubhola kwe-PCB kudinga ukuzinza okuphelele ukuvimbela "ukuhamba" noma ukungahambi kahle kwembobo. I-Proprietary Seismic Blade Edge Design ibhekana nalokhu ngokusebenzisa:
Ijiyomethri ye-Asymmetric Flute: Ibhalansisa ukuphuma kwe-chip kanye nokuncibilika kokudlidliza, inciphisa amandla asemaceleni ngo-40%.
I-Nano-Coated Helix Angle: I-helix engu-30° ene-TiAlN coating inciphisa ukwakheka kokushisa (<70°C) phakathi nokusebenza okuqhubekayo.
Ama-Anti-Resonance Grooves: Amashaneli amancane afakwe i-laser aphazamisa amaza e-harmonic, aqinisekisa ukunemba kokuma phakathi kuka-5µm kuwo wonke ama-PCB angu-10-layer.
Ekuhloleni ukucindezeleka kubhoboza izimbobo ezingu-0.3mm ngokusebenzisa amabhodi agqoke i-aluminium angu-2mm, lezi zingcezu zibonise ukuchezuka okuyiziro emijikelezweni elandelanayo engu-500 - okuyisenzo esingenakuqhathaniswa nezimbangi.
Izicelo Kuzo zonke Izimboni
I-Consumer Electronics
Kwabakhiqizi be-smartphone motherboard:
0.2mm Micro-Vias: Kufinyelelwe izilinganiso zesivuno ezingu-99.9% kumabhodi we-HDI anezendlalelo ezingu-12.
20% Amazinga Okuphakelayo Okushesha Kakhulu: Kunikwe amandla ukungqubuzana okuncishisiwe nokuvala i-chip.
I-Automotive Electronics
Kukukhiqizwa kwemojula yamandla e-EV:
Ukuthembeka Kwezimbobo: Igcinwe u-100% wokuqhubeka kukagesi kuma-substrates angu-1.6mm-thick thermal-conductive.
Ukusebenza Kwamahhala Okupholisa: Ikhono lokumba okomile ligwema ukungcoliswa ezinhlelweni zokulawula ibhethri ezivaliwe.
I-Aerospace & Defense
Ukubhoboza izimbobo ezingu-0.15mm kumasekhethi e-polyimide flex:
I-Zero Delamination: Ngisho nasezindaweni ezinomswakama ophezulu ongu-200°C.
I-EMI Shield Patterning: Ukuqoshwa okunembayo kwezendlalelo zokuvikela ze-RF ezisekelwe ku-graphene.
Imininingwane Yezobuchwepheshe
Ibanga Lobubanzi: 0.1mm–3.175mm (0.004"–1/8")
Uhlobo Lwe-Shank: Okujwayelekile okungu-3.175mm (1/8") noma ukuhambisana kwekholethi le-ER ngokwezifiso
Izinketho zokuhlanganisa: i-TiN (igolide), i-TiCN (eluhlaza okwesibhakabhaka), noma i-Diamond-Like Carbon (DLC)
Ubukhulu be-RPM: 80,000 (kuncike kububanzi)
Ukuhambisana: Imishini yokumba ye-CNC, umshini wokunyathelisa we-PCB ozenzakalelayo, amathuluzi aphethwe ngesandla
Ukusebenza Kwezindleko Kuchazwe Kabusha
Ukuhlaziywa kwezindleko zenzuzo okwenziwa ngumqambi ophambili wase-Taiwanese PCB wembule:
$18,500 Ukonga Ngonyaka: Ukushintshwa kwe-drill bit encishisiwe (kusuka kumasethi ayi-12 kuye kwayi-4/ngonyaka).
15% Ukuncishiswa kwamandla: Izidingo eziphansi zetorque yokuphotha.
Ukusebenza Kabusha Kabusha: Kuqedwe u-$220k/ngonyaka kumabhodi alahliwe ekuzuleni kokubhoboza.
Ukusimama Okwakhelwe Ngaphakathi
Ukupakishwa Okungasetshenziswa Kabusha: 100% amathreyi egwebu angaboli.
I-RoHS & REACH Ukuthobela: Ikhululekile kumthofu, i-cadmium, nezinye izinto eziyingozi.
Impilo Yethuluzi Elinwetshiwe: Ukusetshenziswa kwe-tungsten okuphansi okungu-60% uma kuqhathaniswa nama-drill ajwayelekile.
Ubufakazi bomsebenzisi
"Ukushintshela kulezi zingcezu zensimbi ye-tungsten kube noshintsho," kusho u-Hiroshi Tanaka, uMphathi Wokukhiqiza enkampanini yezinzwa ese-Kyoto. "Simba izimbobo ezingu-20,000 ishifu ngayinye ngaphandle koshintsho lwamathuluzi - into ongeke uyicabange ngezinsimbi zethu ezindala ze-HSS. Umklamo wokuzamazama komhlaba uwodwa unqamule ukulahlwa kwethu kwembobo ngo-95%.
Kungani Khetha Lezi Zingcezu Zokushayelwa Kwebhodi Le-PCB?
Ukunemba Okunganqamuki: Ngokunemba okufana ne-laser kumabhodi we-high-density interconnect (HDI).
Isivinini Ngaphandle Kokuzidela: Bamba izimbobo ezingu-0.3mm emigodini engu-400/ngomzuzu ngaphandle kokulimaza ikhwalithi yonqenqema.
Ukuvumelana kwendawo yonke: Isebenza ne-FR-4, Rogers, aluminium, ngisho namalayini aqiniswe ngengilazi.
Idizayini Yobufakazi Besikhathi esizayo: Ilungele izinto ze-PCB zesizukulwane esilandelayo njengama-dielectrics angenayo i-halogen kanye ne-ultra-low-lossible.
Isiphetho
Embonini lapho yonke i-micron ibeka inzuzo nokusebenza, lezi Tungsten SteelI-PCB Board Drill Bitszingaphezu kwamathuluzi - ziyinzuzo yesu. Ngokuhlanganisa isayensi yezinto ezibonakalayo nobunjiniyela bokuzinza, banika amandla abakhiqizi ukuthi basunduze imikhawulo ye-miniaturization ngenkathi behlikihla.
Isikhathi sokuthumela: Mar-21-2025
