Ngaphansi kwegagasi le-miniaturization eqhubekayo kanye nokuminyana okuphezulu kwemikhiqizo ye-elekthronikhi yomhlaba wonke, ubuchwepheshe bokukhiqiza ibhodi lesifunda eliphrintiwe (PCB) bubhekene nezinselele zokunemba ezingakaze zibonwe. Ukuze kuhlangatshezwane nalesi sidingo, i-MSK (Tianjin) International Trading CO., Ltd isanda kwethula isizukulwane esisha sokunemba okuphezulu.ephrintiwe ibhodi lesifunda sokuprakthiza izingcezuuchungechunge, ukuchaza kabusha amazinga okusebenza amathuluzi okumba anembayo ngesayensi yezinto eziqanjiwe kanye nomklamo wesakhiwo.
Yenziwe ngensimbi ye-tungsten eqinile, yephula umkhawulo wokuqina
Lolu chungechunge lwezinsimbi zokubhoboza lwenziwe ngensimbi ye-tungsten yezinga lendiza, futhi isakhiwo sekristalu siyaqiniswa ngenqubo ye-nano-level sintering, ukuze umkhiqizo ube nakho kokubili ubulukhuni obuphezulu nokuqina kokuqina. Inciphisa ngokuqondile izindleko zokushintsha ithuluzi zabakhiqizi ngo-30%, ikakhulukazi ezifanele izigcawu ezifana namamojula okuxhumana we-5G nama-automotive electronics adinga izendlalelo eziningi eziphezulu zokuminyana ngezimbobo.
Idizayini yephethini ye-anti-vibration blade enamandla, ukunemba kufika kuleveli ye-micron
Ekuphenduleni inkinga yokudlidliza ekucutshungulweni kwemigodi emincane engaphansi kuka-0.2mm, ithimba le-R&D lasungula ngendlela entsha isakhiwo se-spiral gradient blade groove. Ngomumo wejiyomethri olungiselelwe ukulingiswa kwe-fluid dynamics, ingcindezi yokusika ihlakazeka ngokuphumelelayo, futhi i-amplitude yokudlidliza yokucubungula iyancipha ibe yi-1/5 yesilinganiso semboni. Uhlolo lwangempela lubonisa ukuthi ekucubungulweni kobubanzi bembobo engu-0.1mm, ukuchezuka kwendawo yembobo kulawulwa ngokuzinzile phakathi kuka-±5μm, kanye nobuhwaba obungaphezulu obungu-Ra≤0.8μm, obuhlangabezana ngokugcwele nezimfuneko eziqinile ze-submount (SLP) kanye ne-IC submount.
Ukunwetshwa kohlelo lokusebenza lwezimo eziningi
Ngokungeziwe ekusetshenzisweni okuyinhloko kwe-PCB, lolu chungechunge lokuzivivinya luqinisekisiwe emikhakheni yemishini yezokwelapha, imishini yokubona, njll.:
Ingakwazi ukucubungula ngokunembile izimbobo ezincane zokulahla ukushisa zama-ceramic substrates (njenge-aluminium nitride)
Thola ukungena kwe-burr-free kumashidi ensimbi engagqwali awugqinsi ongu-0.3mm
Isetshenziselwa ukuqoshwa kwesiteshi esincane sesikhunta sokuphrinta se-3D
Ukuze uvumelane nezakhiwo zezinto ezibonakalayo ezihlukahlukene, umugqa womkhiqizo uhlinzeka ngama-engeli amathathu we-blade tip angu-30°, 45°, no-60°, futhi uhlanganisa imininingwane yosayizi ogcwele ka-0.05-3.175mm.
Isikhathi sokuthumela: Mar-05-2025
