Kwilizwe elikhawulezayo lemveliso ye-elektroniki, apho ukuchaneka kwenqanaba le-Merron lichaza impumelelo, ukumiliselwa kwebhodi yeBhodi yeBhodi ye-PCB yeBhodi yeBhodi yeBhodi yeBhodi ephawula ubungakanani bomthamo webhodi yebhodi yesiphaluka. Injini yokubhabha, ukubhuka, kunye ne-Micromachiun kwiibhodi zesekethe eziprintiweyo (i-PCBS) kunye nezinye izinto ezinamatye, ezi zintsimbi ze-tungstenI-mini drill pcbIzixhobo zidibanisa izinto zenqanaba le-Aerospace-Ibanga lokuzigcina iziko lokuzinzisa ukucima ukusebenza ngokukuko kunye nobomi obude kwimveliso ephezulu.
Ukugqwesa kubunjineli: Kutheni kubalulekile ukuba senze imicimbi yentsimbi
Kwintliziyo yale bills bits ilele kwi-carbide ye-tungsten ye-tungsten (WC), impahla ekhethwe ngokudityaniswa kwe-hardd engafaniyo (HRA 92), ukunxiba ingqibelelo, kunye nokunyaniseka kwesakhiwo. Ngokungafaniyo ne-HSS eqhelekileyo (intsimbi ephezulu yentsimbi), le turesten yentsimbi ihambisa:
I-3x ixesha elide le-Lindespan: I-Instands ezili-15,000
Isakhiwo se-Micro-Grain: I-Sub-0.50m I-Carbide yokusika i-razor-breyitha yokusika i-razor-breyitha, ifezekisa iidayamitha zeHole njengencinci njenge-0.005MMOOR.
Uyilo lwe-Anti-Fracture: I-shamet yejomet inqanda i-bimet yoqhawulo-msebenzi-rpm (ezingama-30,000-60,000), nakwi-PCBle CCB ye-PCBle ezele.
Uvavanyo lweqela lesithathu ngeZiko loMatshini lokuPhezulu luqinisekisa ukuba le bits igcina i-ra 0.8μm igqibile ukugqiba i-10,000 yemingxunya yokunyaniseka kwi-5G kunye nezixhobo ze-IOI.
Uzinzo lwe-seismic: Ukusika ngaphandle kokulalanisa
I-PCB yokuqhuba ifuna uzinzo olupheleleyo ukuthintela "ukuhamba" okanye umngxunya wokungahambi kakuhle. I-Feistinic Fladery Flader Dead Idilesi:
I-Asymmetric Fometry Geometry: I-chip ye-chip ye-chip kunye nokutshayiswa komhlaba, ukunciphisa imikhosi yangasemva nge-40%.
I-Nano-I-HEIX ye-Englet Engle: I-30 ° I-30
I-Anti-Revoning Grooves: Iitshaneli ezincinci ze-laser tirnels ziphazamisa ii-frequency frequency, qinisekisa ukuchaneka kwendawo ngaphakathi kwe-5μm kwi-5μm iphela i-10-Weider PCBS.
Kuvavanyo lovavanyo lwe-0.3mm nge-2mm ye-2mm ye-2mm ye-aldi, ezi bits zabonisa ukuphambuka kwe-zero ezilandelelanayo - i-fecled ngabakhuphiswano.
Izicelo kumashishini onke
I-elektroniki yabathengi
Abavelisi bamanye amaManya ye-Smartphone:
I-0.2mm micro-Vias: iphunyeziwe i-99.9% yexabiso leSivuno kwiBhodi ye-HDI ye-HDI.
Iipesenti ezingama-20 zereyithi yokutya okukhawulezileyo: enikwe amandla ngokuncitshiswa kwembambano kunye ne-chip.
I-automatic yemoto
Kwi-EV amandla emodyuli yemodyuli:
Ukuthembeka nge-Hole: Igcinwe nge-100% yokuqhubeka kombane kwi-1.6mm-i-subrick ye-thermal-iqhubela phambili.
Ukusebenza kwe-Colant-Free
I-Aerospace kunye noKhuselo
Ukuqhuba i-0.15mm ye-0.15mm ye-Polylimider iseketheji ye-Polyx:
Ukulibazisa okuzibazisiweyo: nkqu nakwiindawo eziphakamileyo ze-200
I-Emi Suble Pages: Ukungena ngokuchanekileyo kwe-Graphene-esekwe kwi-RF
Inkcazo yobugcisa
Uluhlu lobubanzi: 0.1mm-3.172mm (0.004 "-1/8)
Uhlobo lwe-shank: i-3.175mm (1/8 ") okanye isiko esikhokelayo
Ukukhetha okuDibeneyo: I-TIN (igolide), i-ticn (i-Blue), okanye i-carbon efana nedayimane (i-DLC)
I-max RPM: 80,000 (ixhomekeke kububanzi)
Ukungqinelana: oomatshini bokuqhuba oomatshini be-cnc, oomatshini bokushicilela be-PCB ozenzekelayo, izixhobo ezijikeleziweyo
Ukusebenza kweendleko ngokutsha
Uhlalutyo lwenzuzo yexabiso nge-taiwanese ye-taiwanese pcb ityhilwe:
I- $ 18,500 eyogcinayo yonyaka: Ukuncitshiswa kwe-Drill kancinci (ukusuka kwi-12 ukuya kwi-4 yeeseti / unyaka).
I-15% yokuncitshiswa kwamandla: Iimfuno ezisezantsi zeTyuthu.
I-Zero Repwork: Ukupheliswa kwe- $ 220K / unyaka kwiibhodi ezikhutshelweyo kwi-drill zunder.
Ukuzinza okwakha ngaphakathi
Ukuphinda ufake kwakhona: i-100% ye-biodegrady rays.
I-ROHS kunye nokufikelela ukuthotyelwa: akukho sikhokelo, i-cadmium, kunye nezinye izinto eziyingozi.
Isixhobo esandisiweyo Ubomi: 60% I-60% yokusela i-tungsten vs.
IIMPAWU ZAMABHALA
UHiroshi Taits waguqukayo, utshilo umphathi wemveliso kwi-Kyoto esekwe kwi-Kyoto-esekwe kwi-Kyoto. "Siqhuba imingxunya engama-20,000 kwi-Shift nge-Shift engapheliyo-into engenamisebenzi ye-HSS yethu yakudala. Indawo ye-seismic i-Suble Hole-Stores igatya nge-95%."
Kutheni ukhetha le bhodi ye-PCB?
Ukuchaneka okungahambelaniyo: Ukuchaneka kwe-laser-ngokungacacanga kwiBhodi yoDibana eliphezulu (HDI).
Isantya ngaphandle kwedini: drill 0.3mm kwimingxunya ye-400 yemingxunya / umzuzu ngaphandle kokuphawula umgangatho.
I-Universal Disction: Isebenza ngoFr-4, iRogers, iAluminiyam, kunye ne-Gulumini yeGlasi.
Uyilo lobungqina elizayo: Zilungiselele izinto ezilandelayo zePCB ezinje nge-halogn-free kunye ne-ultra-ilahleko yokuphulukana.
Ukuqukumbela
Kwimizi-mveliso apho yonke iMiron ichaza ingeniso kunye nokusebenza, le ntsimbi ye-tungtesIbhodi yeBhodi ye-PCBzingaphezulu kwezixhobo - ziluncedo olucwangcisiweyo. Ngokudibanisa iSayensi yeZinto eziSebenzayo ngokuZinza, baxhobise abavelisi ukuba batyhutyha imida ye-mineatherition ngelixa bengcangcazela
Ixesha lasemva kwexesha: Mar-21 ukuya ku-525
