Kwihlabathi elikhawulezayo lemveliso ye-elektroniki, apho ukuchaneka kwe-micron-level ichaza impumelelo, ukuqaliswa kwe-Next-Gen PCB Board Drill Bits kuphawula ukutsiba kwe-quantum kwibhodi yesekethe. Yenzelwe ukugrumba, ukukrola, kunye ne-micromachining kwiibhodi zesekethe eziprintiweyo (PCBs) kunye nezinye ii-ultra-thin substrates, ezi Tungsten Steel.Mini Drill PCBIzixhobo zidibanisa izixhobo ze-aerospace-grade kunye neteknoloji yokuzinza kwe-seismic ukuchaza kwakhona ukusebenza kakuhle kunye nokuphila ixesha elide kwimveliso ephezulu.
UbuNjineli obuGqwesileyo: Kutheni i-Tungsten Steel ibalulekile
Embindini wale mibhobho ye-drill ilele i-high-purity tungsten carbide (WC), imathiriyeli ekhethelwe ukudityaniswa kobunzima obungalinganiyo (HRA 92), ukuxhathisa ukunxiba, kunye nokuthembeka kwesakhiwo. Ngokungafaniyo ne-HSS eqhelekileyo (i-High-Speed Steel) yoqheliso, olu qulunqo lwentsimbi ye-tungsten luhambisa:
3X Ubomi obude: Ukumelana nemijikelo eyi-15,000+ yokomba kwiibhodi ze-fiberglass ze-FR-4 ngaphandle kokuthotywa komphetho.
Ulwakhiwo lweMicro-Grain: I-Sub-0.5µm iinkozo ze-carbide ziqinisekisa imiphetho yokusika i-razor-ebukhali, ukufikelela kwidayamitha yomngxuma ibencinci njenge-0.1mm kunye ne-±0.005mm yokunyamezela.
Uyilo lwe-Anti-Fracture: I-geometry ye-shank eyomeleziweyo ikhusela ukuphuka ngexesha le-RPM ephezulu (30,000-60,000) yokusebenza, nakwizinto eziphathekayo ze-PCB ezizaliswe yi-ceramic.
Uvavanyo lomntu wesithathu yi-Precision Machining Institute of Technology iqinisekisa ukuba ezi bits zigcina i-Ra 0.8µm yokugqiba umphezulu emva kwemingxuma ye-10,000 - into ebaluleke kakhulu kwi-high-frequency signal integrity in 5G kunye nezixhobo ze-IoT.
Uzinzo lweSeismic: Ukusika Ngaphandle Kokulalanisa
Ukugrumba kwePCB kufuna uzinzo olupheleleyo ukuthintela "ukuhamba" okanye ukungahambi kakuhle komngxuma. Uyilo loMda weSeismic Blade Edge ujongana noku:
Ijiyometri yeFlute ye-Asymmetric: Ilinganisa ukufuduswa kwetshiphu kunye ne-vibration damping, ukunciphisa amandla asecaleni ngama-40%.
I-Nano-Coated Helix Angle: I-30 ° i-helix ene-TiAlN yokugubungela inciphisa ukwakhiwa kobushushu (<70 ° C) ngexesha lokusebenza okuqhubekayo.
I-Anti-Resonance Grooves: I-Laser-etched micro-channels iphazamisa i-harmonic frequencies, iqinisekisa ukuchaneka kwendawo ngaphakathi kwe-5µm kwi-10-layer PCBs.
Kuvavanyo loxinzelelo lokomba imingxuma eyi-0.3mm nge-2mm yeebhodi ze-aluminium-clad, ezi bits zibonise ukutenxa kwi-zero kwimijikelo engama-500 elandelelanayo - into engenakuthelekiswa nabakhuphisana nabo.
Izicelo kuwo wonke amaShishini
I-Electronics yabathengi
Kubenzi bebhodi ye-smartphone:
I-0.2mm Micro-Vias: Iphumelele i-99.9% imilinganiselo yesivuno kwiibhodi ze-HDI ze-12-layer.
I-20% Amaxabiso okutya okuKhawuleza: Yenziwe ngokunciphisa ukukhuhlana kunye ne-chip clogging.
I-Electronics yeemoto
Kwimveliso yemodyuli yamandla e-EV:
Ngokuthembeka kwe-Hole: Igcinwe i-100% yokuqhubekeka kombane kwi-1.6mm-thick-thermal-conductive substrates.
UkuSebenza kwaMahala okuPholisa: Ukukwazi ukugrumba okomileyo kuthintela ungcoliseko kwiinkqubo zolawulo lwebhetri etywiniweyo.
I-Aerospace kunye noKhuseleko
Ukugrumba imingxunya eyi-0.15mm kwiisekethe ze-polyimide flex:
Zero Delamination: Nakwi-200°C kwindawo zokufuma okuphezulu.
I-EMI Shield Patterning: Umzobo ochanekileyo wegraphene-based RF shielding layering.
IiNgcaciso zobuGcisa
Uluhlu lweDiameter: 0.1mm–3.175mm (0.004"–1/8")
Uhlobo lwe-Shank: Umgangatho we-3.175mm (1/8") okanye ukuhambelana kwe-collet yesiko le-ER
Iinketho zokugquma: iTiN (igolide), iTiCN (ebhlowu), okanye iDiamond-NjengeCarbon (DLC)
Ubukhulu be-RPM: 80,000 (ixhomekeke kububanzi)
Ukuhambelana: oomatshini bokomba be-CNC, oomatshini bokuchwetheza bePCB abazenzekelayo, izixhobo ezijikelezayo eziphathwa ngesandla
Ukuchazwa ngokutsha kweendleko
Uhlalutyo lweendleko-inzuzo eyenziwe ngumqambi ophambili we-PCB waseTaiwan utyhile:
$18,500 Annual Savings: Yehlisiwe drill bit replacements (ukusuka 12 ukuba 4 iiseti / ngonyaka).
I-15% yokuNcitshiswa kwamandla: Iimfuno eziphantsi ze-spindle torque.
I-Zero Rework: Kupheliswe i-220k yeedola ngonyaka kwiibhodi ezilahliweyo ukusuka kwi-drill wander.
Uzinzo olwakhelwe ngaphakathi
Ukupakishwa okuRecyclable: I-100% yeetreyi ze-foam ezinokonakala.
I-RoHS & FIKELELA kuThotyelo: Isimahla kwilothe, i-cadmium, kunye nezinye izinto eziyingozi.
Ubomi besixhobo esandisiweyo: I-60% yokusetyenziswa kwe-tungsten ephantsi vs.
Iingqinisiso zabasebenzisi
"Ukutshintshela kwezi ntsimbi zentsimbi ye-tungsten kwakutshintshile," utshilo u-Hiroshi Tanaka, uMphathi weMveliso kumenzi wenzwa esekwe eKyoto. "Sigrumba imingxuma engama-20,000 kwishifti nganye ngaphandle kotshintsho lwesixhobo - into engenakucingelwa ngoqheliso lwethu oludala lwe-HSS. Uyilo lwenyikima lulodwa lunqumle ukugatywa kwethu kwemingxuma ngama-95%.
Kutheni le nto ukhethe ezi Bits zeBhodi yePCB?
Ukuchaneka okungaqhawukiyo: Ukuchaneka okufana ne-laser kwiibhodi ze-high-density interconnect (HDI).
Isantya ngaphandle kwedini: Gcoba imingxuma eyi-0.3mm kwimingxuma engama-400 / ngomzuzu ngaphandle kokunciphisa umgangatho womgangatho.
I-Universal Compatibility: Isebenza kunye ne-FR-4, i-Rogers, i-aluminium, kunye ne-laminates eqiniswe ngeglasi.
Uyilo-bubungqina bexesha elizayo: Ilungele izixhobo zePCB ezizayo ezifana ne-halogen-free kunye ne-ultra-low-low- loss dielectrics.
Ukuqukumbela
Kwishishini apho yonke i-micron iyalela ingeniso kunye nokusebenza, ezi Tungsten SteelPCB Board Drill Bitszingaphezulu kwezixhobo – ziluncedo lweqhinga. Ngokudibanisa isayensi yezinto eziphathekayo kunye nobunjineli obuzinzo, baxhobisa abavelisi ukuba batyhale imida ye-miniaturization ngelixa beqhekeza.
Ixesha lokuposa: Mar-21-2025
