Isizukulwana esitsha seBhodi yeBhodi yeSiphaluka seSiphaluka sikhokelela kwintsholongwane yokufaka imveliso ye-elektroniki

Phantsi kwendlu ye-Minimurization eqhubekayo kunye nokuxinana okuphezulu kweemveliso ze-elektroniki ze-elektroniki, iBhodi yeBhodi yeSekethe (i-PCB) ijongene nemiceli mngeni engathethekiyo. Ukufezekisa le mfuno, i-MSK (i-tianjin) yokuRhweba kwiHlabathi CO., I-LTD isandula ukuqalisa isizukulwane esitsha sokuchaneka okuphezuluIbhodi yebhodi yesiphaluka yeseketheSerichunge, Ukuphinda utshatele imigangatho yokusebenza yezixhobo zokuntywila kokuchaneka kwenzululwazi kunye noyilo lwesakhiwo.

Yenziwe ngentsimbi ye-ultra-tungsten yentsimbi, ukophula umda womoya wokuqina

Olu ngcelele lwe-bits ze-Drill lwenziwe ngentsimbi ye-tungsten yenqanaba le-tungsten, kwaye isakhiwo sekristali somelezwa ngenkqubo yokuthinta inqanaba le-nano, ukuze imveliso inobuqili obuninzi kunye nobunzima obunzima. Inciphise ngokuthe ngqo iindleko zokutshintshwa kwabavelisi nge-30%, ngakumbi ilungele iimodyuli ze-5G ezifana neemodyuli zonxibelelwano ezingama-5g kunye ne-Abookmotive ye-Auto-efuna imingxunya.

brocas para compaos

 

I-Dynamic Anti-I-Anti-I-Anti yoyilo lwephethini, ichanekile kwinqanaba le-micron

Ukuphendula ingxaki ye-ficketion kwi-Ultra-micro-micro-encinci engaphantsi kwe-0.2mm, i-R & D Iqela eline-Provic Properal Groove Groove Groove Groove. Ngemilo yejometri elungiselelwe i-gesid yokulinganisa, uxinzelelo olunqamlezileyo lusasazeke ngempumelelo, kwaye i-AMPIFT yokuSebenzisa iMpawuli incitshisiwe incitshisiwe kwi-1/5 yomndilili weShishini. Olona vavanyo lubonisa ukuba ekuqhubekeni kwe-0.1 + isikhundla sobusuku silawulwa nge-5:

Ukwanda kwesicelo semondo semozulu

Ukongeza kwisicelo esiphambili se-PCB, olu cekeceko lwe-drill lungqinisisiwe kwicandelo lezixhobo zonyango, izixhobo ze-ofts, njl njl:

Ingaqhuba ngokuchanekileyo imingxunya ye-speripation encinci ye-ceramic termic (njenge-aluminium nitride)

Kufezekisa ukungena kwe-Burr-free kwi-0.3mm i-steight sheet sties

Isetyenziselwe ukuthoba i-micronel ekhupha i-3D yokuprinta

Ukuziqhelanisa neepropathi ezahlukeneyo zezinto ezibonakalayo, umgca wemveliso ubonelela ngee-pic ezintathu ze-30 °, i-45 ° ukuya no-60 ° kunye ne-60 °, kwaye ugubungele ubungakanani obupheleleyo be-0.05-75mm.

Ibhodi yePC Drill Bits


Ixesha leposi: Mar-05-2025

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