IsiZukulwana esitsha seBhodi yeSekethe eShicileleyo yoYilo lweBits iKhokela kwi-Electronic Manufacturing Revolution.

Ngaphantsi kwamaza okuqhubela phambili kwe-miniaturization kunye nokuxinana okuphezulu kweemveliso ze-elektroniki zehlabathi, ibhodi yesekethe eprintiweyo (PCB) yokuvelisa itekhnoloji ijongene nemingeni echanekileyo engazange ibonwe ngaphambili. Ukuhlangabezana nale mfuno, i-MSK (Tianjin) yoRhwebo lwaMazwe ngaMazwe CO., Ltd isanda kuqalisa isizukulwana esitsha sokuchaneka okuphezulu.ibhodi yesekethe eprintiweyo drill amasuntswanauthotho, ukucacisa ngokutsha imigangatho yokusebenza yezixhobo zokomba ezichanekileyo ngesayensi yezinto ezintsha kunye noyilo lwesakhiwo.

Yenziwe ngentsimbi ye-ultra-hard tungsten, iphula umda wokuqina

Olu luhlu lwe-drill bits lwenziwe nge-aviation-grade tungsten steel, kunye nesakhiwo sekristale siqiniswa ngenkqubo ye-nano-level sintering, ukwenzela ukuba imveliso ibe nobulukhuni be-ultra-high kunye ne-balance balance. Inciphisa ngokuthe ngqo indleko yokutshintshwa kwesixhobo sabavelisi nge-30%, ngokukodwa ifanelekile kwimiboniso efana neemodyuli zonxibelelwano ze-5G kunye ne-automotive electronics ezifuna i-multi-layer high-density ngokusebenzisa imingxuma.

Uyilo lwephethini yeblade ye-anti-vibration enamandla, ukuchaneka ukuya kwinqanaba le-micron

Ukusabela kwingxaki yokungcangcazela kwi-ultra-micro hole processing engaphantsi kwe-0.2mm, iqela le-R&D liphuhlise ngokuyilayo ubume be-spiral gradient blade groove. Ngokusebenzisa imilo yejometri ephuculwe yi-fluid dynamics simulation, uxinzelelo lokusika lusasazwa ngokufanelekileyo, kwaye i-process vibration amplitude iyancitshiswa ukuya kwi-1/5 ye-avareji yoshishino. Iimvavanyo ezizizo zibonisa ukuba ekusetyenzweni komngxuma we-0.1mm, ukutenxa kwisithuba somngxuma kulawulwa ngokuzinzileyo ngaphakathi kwe-± 5μm, kunye noburhabaxa bomphezulu i-Ra≤0.8μm, ehlangabezana ngokupheleleyo neemfuno ezingqongqo ze-submount (SLP) kunye ne-IC submount.

Ukwandiswa kwesicelo esinemeko ezininzi

Ukongeza kwisicelo esingundoqo se-PCB, olu luhlu lwe-drill luye lwaqinisekiswa kwimimandla yezixhobo zonyango, izixhobo zokukhanya, njl.

Iyakwazi ukwenza ngokuchanekileyo imingxunya yokulahla ubushushu obuncinci be-ceramic substrates (njenge-aluminiyam nitride)

Ukufikelela kwi-burr-free kwi-0.3mm yamashiti entsimbi etyebileyo

Isetyenziselwa ukukrola i-micro-channel ye-3D yokubumba yoshicilelo

Ukulungelelanisa kwiimpawu zezinto eziphathekayo, umgca wemveliso ubonelela ngee-angles ezintathu ze-blade tip of 30 °, 45 °, kunye ne-60 °, kwaye igubungela ubungakanani obupheleleyo be-0.05-3.175mm.