Tlas'a leqhubu la ts'ebetso e ntseng e tsoela pele ea miniaturization le bongata bo phahameng ba lihlahisoa tsa elektroniki tsa lefats'e, theknoloji ea tlhahiso ea li-circuit board (PCB) e tobane le mathata a neng a e-so ka a bonoa. Ho fihlela tlhoko ena, MSK (Tianjin) International Trading CO., Ltd e sa tsoa qala moloko o mocha oa ho nepahala ho phahameng.likotoana tsa boto ea potoloho tse hatisitsoengletoto, ho hlakisa bocha maemo a ts'ebetso ea lisebelisoa tsa ho cheka tse nepahetseng ka mahlale a macha le moralo oa sebopeho.
E entsoe ka tšepe ea tungsten ea Ultra-hard, e senyang moeli oa ho tšoarella
Letoto lena la li-drill bits li entsoe ka tšepe ea tungsten ea boemo ba sefofane, 'me sebopeho sa kristale se matlafatsoa ka mokhoa oa nano-level sintering, e le hore sehlahisoa se be le boima bo phahameng haholo le ho leka-lekana ho thata. E fokotsa ka ho toba litšenyehelo tsa ho fetola lisebelisoa tsa bahlahisi ka 30%, haholo-holo tse loketseng lipapali tse kang li-module tsa puisano tsa 5G le lisebelisoa tsa elektronike tsa likoloi tse hlokang li-multi-layer high-density ka likoti.
Moralo o matla oa lehare la anti-vibration, o nepahetseng ho fihla boemong ba micron
Ho arabela bothata ba ho thothomela ha ho etsoa likoti tse nyane tse ka tlase ho 0.2mm, sehlopha sa R&D se ile sa qapa sebopeho sa spiral gradient blade groove. Ka sebopeho sa geometri se ntlafalitsoeng ke ketsiso ea matla a mokelikeli, khatello ea maikutlo e qhalakantsoeng ka nepo, 'me amplitude ea ts'ebetso ea vibration e fokotsehile ho 1/5 ea karolelano ea indasteri. Liteko tsa 'nete li bonts'a hore ts'ebetsong ea bophara ba lesoba la 0.1mm, ho kheloha ha boemo ba lesoba ho laoloa ka mokhoa o tsitsitseng ka har'a ± 5μm, le bokaholimo ba Ra≤0.8μm, bo fihlelang ka botlalo litlhoko tse thata tsa submount (SLP) le IC submount.
Katoloso ea ts'ebeliso ea maemo a mangata
Ntle le ts'ebeliso ea mantlha ea PCB, letoto lena la li-drill le netefalitsoe libakeng tsa lisebelisoa tsa bongaka, lisebelisoa tsa optical, joalo-joalo:
E ka sebetsana ka nepo le masoba a manyane a ho lahla mocheso oa li-ceramic substrates (joalo ka aluminium nitride)
Fumana ho kenella ntle le burr ho matlapa a 0.3mm a tšepe a se nang tšepe
E sebelisoa bakeng sa ho betla li-micro-channel tsa liforomo tsa khatiso tsa 3D
Ho ikamahanya le thepa e fapaneng ea thepa, mohala oa sehlahisoa o fana ka li-angles tse tharo tsa lehare la 30 °, 45 °, le 60 °, 'me o akaretsa lintlha tse feletseng tsa 0.05-3.175mm.
Nako ea poso: Mar-05-2025
