Munyika yakamhanya-yakakurumidza kugadzira, uko micron-level-level-level-sumo yeinotevera -G PCB Board Drill Bits in Quio Board Board Bhodhi. Injiniya yekukweva, kunyora, uye micromaching pane yakadhindwa wedunhu mabhodhi (PCBS) uye mamwe eltra-akaonda, aya tungsten simbiMini Drill PCBZvishandiso zvinobatanidza Aerospace-giredhi zvinhu zvine seismic kuderedzwa tekinoroji kutsanangudza kushanda kwetsananguro uye hurefu mukugadzirwa kwepamusoro-vhoriyamu.
Injiniya Kunaka: Nei Tungsten Steel Matanho
Pamwoyo yeaya ekudhara mabheti manyoreredzo Kusiyana neRSS HSS (yakakwira-yekumhanyisa simbi) inodhara, iyi tungsten simbi yekuumbwa inotumirwa:
3X HERE LIONSPAN: Akangwara 15,000+ Kudhirowa Craps paFr-4 Fiberglass Mabhodhi Pasina Kugadziriswa Kwemadhura.
Micro-zviyo zvigadzirwa: Sub-sub-0.5μm carbide zvirovera-sharm yekucheka, kuwana gomba diameters sechidiki senge 0.1005mm kushivirira.
Anti-Fracture Dhizaini: yakasimbiswa Shank geometry inodzivirira kuputsa panguva yepamusoro-rpm (zviuru makumi matatu zvemazana) mashandiro, kunyangwe muBrittle Ceramic-akazadzwa PCB Zvigadzirwa.
Yetatu-bato kuyedzwa neyekunyora kuMaccess Institute of Technology Inosimbisa idzi Bits chengetedza Ra 0.8μm yekupedzisa mushure megumi mashambadzi
Kugutsikana kweSeismic: Kucheka pasina kuwirirana
PCB Drilling inoda kugadzikana zvachose kudzivirira "kufamba" kana gomba raipisa. Iyo yekufungidzira seismic blade yemupendero dhizaini kero izvi kuburikidza:
Asymmetric flute Geometry: Balances Chip Kubviswa uye Vibration Sripping, kuderedza Lateral Mauto ne40%.
Nano-akanyura helix angle: A 30 ° Helix neTialn Coating kuderedza kupisa (<70 ° C) panguva yekuenderera mberi kushanda.
Anti-Resonance Grooves: Laser-Ketched Micro-Church kukanganisa Harmonic Frequencies, inoverengera nzvimbo yekunyatsoitika mukati me5μm kuyambuka 10-layer PCS.
Mukushushikana bvunzo yekukwevera 0.3mm marowa kuburikidza ne 2mm aluminium-mabhodhi emakwenzi, aya mabheti airatidza zero kutsauka pamusoro pe500 inoteedzana mitezo - a feat isina kugadzikana nevanokwikwidza.
Zvishandiso Pakati Maindasitiri
Vatengi vezvematengi
Kune smartphone momboard Vagadziri:
0.2mm micro-vias: inowanikwa 99.9% inoberekera mitengo pa12-denderedzwa hdi mabhodhi.
20% inokurumidza kudzora mitengo: yakagoneswa nekudzikira kupfava uye chip clgging.
Zvemagetsi emagetsi
MuEv Power Module kugadzirwa:
Kupfuura-gomba kuvimbika: kuchengetwa 100% yemagetsi kuenderera mberi mu 1.6mm-gobvu thermal-inogadzirisa substrates.
Kutonhorera-kusununguka kushanda: Dry Drilling Kugona Kudzivirira kusvibiswa mubhatiri rakavharwa mabheti emana.
Aerospace & Defense
Kudhirowa 0.15mm Holes muPolyimide Flex Zvitoro:
Zero Delalast: Kunyangwe muna 200 ° C High-Humidity nharaunda.
EMI Shiel Draterning: Excecision Engraving yeGriphene-based RF Selfering Layers.
Tekinoroji Rondedzero
Diameter range: 0.1mm-3.175mm (0.004 "-1/8")
Shank Type: Standard 3.175mm (1/8 ") kana tsika er collet kuenderana
Kubatanidza Sarudzo: Tin (Goridhe), TICN (Blue), kana Diamond-seCarbon (DLC)
Max RPM: 80,000 (inoenderana neDhamita)
Kuenderana: Cnc Drilling Machina, otomatiki PCB Drill Presses, Handheld rotary zvishandiso
Mutengo unobata zvakagadzirwazve
Kuongororwa-Kunobhadharwa Kuongororwa neTaiwan Taiwanese PCB Fabricator Yakaratidzwa:
$ 18,500 egore rinochengetedza: Yakaderedzwa Drill bit kutsiva (kubva pagumi nemaviri kusvika mana seti / gore).
15% Kuderedza Energy: Lower Spindle Torque zvinodiwa.
Zero Rework: Yakabviswa $ 220k / gore mumabhodhi akaputirwa kubva kuDhill Wander.
Kusimba kwakavakwa mukati
Dzokorora Packing: 100% biodegradable foam trays.
Rohs & Svika pakuteerera: Mahara kubva kuTriver, Cadmium, uye zvimwe zvinhu zvine ngozi.
Hupenyu hwakasimba hwekushandisa: 60% yakaderera tungsten kushandiswa vs. akajairwa akajairwa.
Zvipupuriro zveMushandisi
"Kuchinja kune aya tungsten Simbi Bits yaive shanduko," anodaro Hiroshi Taid, maneja ekugadzira pane kyoto-based sensor mugadziri. "Tiri kugeza maburi zviuru makumi maviri pakuchinja pasina chishandiso chekuchinja - chimwe chinhu chisingafungidzirwe neyedu yekare HSS
Nei uchisarudza iyi PCB Board Drill Bits?
Kuregedza chaiko: nekuti laser-sekujeka mune yakakwira-density interconnect (HDI) mapuranga.
Kumhanyisa pasina chibayiro: Drill 0.3mm Holes pa400 maburi / miniti pasina kukanganisa kumucheto kwemugumo.
Underalational inoenderana: inoshanda naFr-4, rogers, aluminium, uye kunyange girazi-rakasimbiswa laminates.
Remangwana-Proof Dhizaini: Gadzirira Inotevera -G PCB Zvigadzirwa Senge Halogen-Free uye Ultra-Low-Low-Loss-Live Dooctrics.
Mhedziso
Mune indasitiri iyo micron yega yega inodudzira mari yekubatsira uye kuita, aya tungsten simbiPCB Board Drill Bitszvinopfuura zvishandiso - iwo mukana wakarongeka. Nekubatanidza nyaya yesainzi ine kugadzikana engineering, ivo vanopa vanogadzira kusundira miganhu ye miniaturization paunenge uchirovera
Kutumira Nguva: Mar-21-2025
