N'ime ụwa ngwa ngwa nke nrụpụta eletrọnịkị, ebe nhazi ọkwa micron na-akọwapụta ihe ịga nke ọma, iwebata Next-Gen PCB Board Drill Bits na-aka akara nrịba elu n'ichepụta bọọdụ sekit. Emebere ya maka igwu mmiri, ihe osise, na micromachining na bọọdụ sekit e biri ebi (PCBs) na ihe ndị ọzọ dị oke mkpa, Tungsten Steel ndị a.Obere Drill PCBNgwa na-ejikọta ihe ikuku-ọkwa ikuku na teknụzụ nkwụsi ike nke seismic iji kọwapụta arụmọrụ na ogologo ndụ n'ime mmepụta oke dị elu.
Injinia Ọkachamara: Gịnị kpatara Tungsten Steel ji dị mkpa
N'ime obi nke ngwungwu ihe ndị a bụ tungsten carbide (WC) dị ọcha, ihe a họọrọ maka ngwakọta siri ike ya na-enweghị atụ (HRA 92), na-eyi nguzogide, na iguzosi ike n'ezi ihe. N'adịghị ka usoro HSS (High-Speed Steel) a na-emebu, nchara tungsten a na-enye:
3X Ogologo ndụ ogologo oge: Na-akwado usoro ịgbapu 15,000+ na bọọdụ fiberglass FR-4 na-enweghị mmebi ihu.
Ọdịdị Micro-Grain: Sub-0.5µm carbide grains na-eme ka ọnụ ọgụgụ agụba dị nkọ, na-enweta dayameta oghere dị ka 0.1mm na ± 0.005mm.
Nhazi mgbochi mgbawa: geometry shank gbasiri ike na-egbochi mmebi n'oge arụ ọrụ RPM dị elu (30,000-60,000), ọbụlagodi na ihe PCB jupụtara seramiiki.
Nnwale ndị ọzọ sitere na Precision Machining Institute of Technology na-akwado ibe n'ibe ndị a na-edobe elu Ra 0.8µm mgbe oghere 10,000 gasịrị - ihe dị mkpa maka iguzosi ike n'ezi ihe nrịbama dị elu na ngwaọrụ 5G na IoT.
Seismic kwụsie ike: ịcha na-enweghị nkwekọrịta
Mgwupu PCB chọrọ nkwụsi ike zuru oke iji gbochie "ịga ije" ma ọ bụ enweghị oghere. The Proprietary Seismic Blade Edge Design na-akọwa nke a site na:
Geometry flu asymmetric: na-edozi mgbapụ mgbapụ na mbelata mkpọtụ, na-ebelata ike akụkụ site na 40%.
Nano-Coated Helix Angle: A 30 ° helix na mkpuchi TiAlN na-ebelata okpomọkụ (<70°C) n'oge ọrụ na-aga n'ihu.
Grooves Mgbochi Resonance: Ọwa obere ọwa Laser-etched na-akpaghasị usoro nkwekọ, na-ahụ maka izi ezi n'etiti 5µm n'ofe PCB nke 10-layer.
N'ime ule nrụgide mgbawa oghere 0.3mm site na bọọdụ mkpuchi aluminom 2mm, ibe n'ibe ndị a gosipụtara ngbanwe efu karịa usoro okirikiri 500 sochiri - nke ndị asọmpi enweghị atụ.
Ngwa gafere ụlọ ọrụ
Eletrọnịkị ndị ahịa
Maka ndị na-emepụta motherboard smartphone:
0.2mm Micro-Vias: Emetara 99.9% ọnụego mkpụrụ na bọọdụ HDI-layer 12.
20% Ọnụego nri ngwa ngwa: agbanyere mbelata esemokwu na mgbawa mgbawa.
Igwe ọkụ eletrik
Na mmepụta modul ike EV:
Ntụkwasị obi site na oghere: Na-akwado 100% eletriki na-aga n'ihu na 1.6mm-mkpụrụ ọkụ na-eduzi.
Ọrụ na-enweghị oyi oyi: Ike mkpọ mmiri akọrọ na-ezere mmetọ na sistemụ njikwa batrị emechiri emechi.
Aerospace & Nchekwa
Ịkụpụta oghere 0.15mm na sekit flex polyimide:
Zero Delamination: Ọbụlagodi na gburugburu iru mmiri dị 200C.
Nhazi Shield EMI: Ihe osise ziri ezi maka akwa mkpuchi RF dabere na graphene.
Nkọwa nka nka
Oke dayameta: 0.1mm–3.175mm (0.004"-1/8")
Ụdị Shank: Ọkọlọtọ 3.175mm (1/8) ma ọ bụ ndakọrịta ER collet omenala
Nhọrọ mkpuchi: TiN (ọlaedo), TiCN (acha anụnụ anụnụ), ma ọ bụ diamond-dị ka Carbon (DLC)
Oke RPM: 80,000 (dabere na dayameta)
Ndakọrịta: igwe CNC na-egwuputa ihe, igwe na-akụ PCB akpaaka, ngwaọrụ rotary ejiri aka
Akọwapụtaghachiri arụmọrụ ọnụ ahịa
Nyocha uru bara uru nke onye ndu Taiwanese PCB mepụtara kpughere:
$18,500 Nchekwa Kwa afọ: Mbelata ihe ngbanwe nke obere ihe (site na 12 ruo 4 set/afọ).
Mbelata ike 15%: Ihe achọrọ n'ọkpụkpụ spindle dị ala.
Nrụgharị efu: Wepụrụ $220k / afọ n'ime bọọdụ ndị a chụpụrụ n'okirikiri.
Nkwagide Ewubere na
Nkwakọ ngwaahịa a ga-emegharịgharị: 100% traịlị ụfụfụ nwere ike imebi.
Nrubeisi RoHS & REACH: enweghị isi, cadmium na ihe ndị ọzọ dị ize ndụ.
Ndụ Ngwá Ọrụ Mgbatị: 60% obere tungsten oriri vs. ọkọlọtọ drills.
Akaebe onye ọrụ
"Ịgbanwe na nchara nchara tungsten ndị a na-agbanwe agbanwe," ka Hiroshi Tanaka, Onye njikwa mmepụta na onye nrụpụta ihe mmetụta dabere na Kyoto kwuru. "Anyị na-egwupụta oghere 20,000 kwa mgbanwe na-enweghị mgbanwe ngwá ọrụ - ihe a na-apụghị ichetụ n'echiche na ihe omume ochie HSS anyị. Ntugharị seismic nanị na-ebelata oghere anyị na-ajụ 95%."
Kedu ihe kpatara họrọ PCB Board Drill Bits?
Nkenke na-adịghị emebi emebi: Maka izi ezi dị ka laser na bọọdụ njikọ njikọ dị elu (HDI).
Ọsọ Na-enweghị Àjà: Kpoo oghere 0.3mm na oghere 400 / nkeji na-emebighị mma ihu.
Ndakọrịta zuru ụwa ọnụ: Na-arụ ọrụ na FR-4, Rogers, aluminom, na ọbụna laminates agbasiri ike.
Ngosipụta nke ga-eme n'ọdịnihu: Dị njikere maka ihe PCB na-esote-gen dị ka halogen-free na ultra-low-loss dielectrics.
Mmechi
N'ime ụlọ ọrụ ebe micron ọ bụla na-ekwupụta uru na arụmọrụ, Tungsten Steel ndị aPCB Board Drill Bitskarịa ngwaọrụ - ha bụ uru atụmatụ. Site na ijikọ sayensị ihe onwunwe na injinia kwụsiri ike, ha na-enye ndị na-emepụta ikike ịkwanye oke nke miniaturization mgbe ha na-egbutu.
Oge nzipu: Mar-21-2025
