Ma ka honua wikiwiki o ka hana uila, kahi e wehewehe pono ai i ke kūleʻa o ka papa ma kahi o ka papa o ka papa ma kahi o ka papa inoa o ka papa. Nā mea hana no ka laweʻana,ʻo ka hanaʻana, a me ka micromeching ma luna o nā papa i paʻiʻia (pcbs) a me nā kiʻiʻoniʻoni'ē aʻeMini Drill PCBNā mea hana e hoʻohui ai i nā mea hana aerespace-surbic me kaʻenehana stibic Stability e hoʻokaʻawale i ka hana kūpono a me ka lōʻihi i ka hana kiʻekiʻe.
ʻO nā mea hana makaʻikaʻi: no ke aha nā mea kila Tungsten
Ma ka puʻuwai o kēia mau pahu Drill i nā kīwī kiʻekiʻe kiʻekiʻe-hoʻomaʻemaʻe kiʻekiʻe (WC), kahi mea i kohoʻia no ka paʻakikī o ka paʻakikī. ʻAʻole hiki i ka Hisventiol Hss
3x lōʻihi e ola nei
ʻO ka papa inoa o ka micro-grain: sub-0.56
ʻO nā hoʻolālā Anti-Fracture: hoʻoikaikaʻiaʻo Shank Greak Geometry e wāwahi i ka wā kiʻekiʻe-RPM (30,000-60,000
ʻO ka hapakolu o kaʻaoʻao o ke kauʻana ma ka hana machini o kaʻenehana i hōʻoiaʻia i kēia mau bit ma hope o 10,000 mau mea koʻikoʻi ma hope o 10g a me nā polokalamu koʻikoʻi.
Seisisc cebility:ʻokiʻoki me kaʻole o ka hoʻopiliʻana
Ua koi akuʻo PCB i nā koi kūpono i ke kūpaʻa e pale ai i ka "hele" a iʻole ka lōʻihi kolohe. ʻO ka papa inoaʻo SPPrieTary Slade e kuhikuhi ana i kēia ma kēia:
ʻO Asymmetric flute geometry: clances chip clap evacuation a me ka haunaele, hōʻemi i nā maʻi hope ma ka 40%.
Nano-coated helix Angle: he 30 ° Helua me ka colomizes wela (<70 ° C) i ka hana mau.
ʻO Anti-resonance Grooves: Laser-Etro-channels micronels harmonic frelucies
Ma kahiʻano hoʻokolohua kaumaha e hoʻopaʻa ana i nā lua 0.3mm mau lua ma kahi o 2mmluinum-Clad i hōʻikeʻia ma luna o nā mea hoʻokūkū ma luna o nā mea hoʻokūkū.
Nā noi ma waena o nāʻoihana
Mea uila
No nā mea hana aloha Mobileboard:
0.2mm micro-Vias: Loaʻa iā 99.9% mau kumukūʻai e hāʻawi ana i nā papa o 12-mau papa.
ʻO 20% mau kumukūʻai e loaʻa ana i nā kumukūʻai nui: hiki i ka hoʻemiʻana i ka Friction a me Chip Clock.
Kaʻaahi kalaiwa
I ka hana module module:
Ma o ka lua o ka-a me nā mea e mālamaʻia ai he 100% electrical ma kahi o 1,6mm-bigl-bigl-cound byrmal-cound byrmal
ʻO ka hana hoʻopunipuni
Aerospace & Cookena
Hoʻopili i nā lua 0.15mm mau lua i nā kiʻiʻo Polyimide Flecpe:
Zero Delamintion:ʻOiai ma 200 ° C kiʻekiʻe kiʻekiʻe.
ʻO EMI Shinding EMI
Nā kiko pili Tech
ʻO ka pae'āina: 0.1mm-3.175mm (0.004 "-1/8")
Shank type: Kūʻai 3.175mm (1/8 ") a iʻole ka cerdit el collic collatibility
Nā koho koho: Tin (Gold), Ticn (blue), a iʻole he daimana-like carbon (dlc)
Max RPM: 80,000 (hilinaʻiʻia i ka diameter)
ʻO ka hoʻohālikelike: CNC Drilling mīkini, automated PCB Drill Bock
Uku uku uku hou
ʻO kahi loiloi kumukūʻai kumukūʻai e kahi alakaʻi alakaʻi alakaʻi Taiwanese PCB
He $ 18,500 mau kālā kālā makahiki
15% hoʻemiʻana o ka ikehu: nā mea haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa.
ʻO ka hana hou: Hoʻopau i $ 220k / makahiki i nā papa i kālaiʻia mai nā pahu kaʻa.
Ua kūkuluʻiaʻo Sussaintability i loko
ʻO ka hoʻopili houʻana: 100% biodegratable Foom Trays.
Rohs & hiki i ka hoʻokōʻana: FREE mai ke alakaʻi,ʻo Cadmium, a me nā meaʻino'ē aʻe.
ʻO ke ola hana i hoʻonuiʻia: 60% haʻahaʻa haʻahaʻa haʻahaʻa ma luna o nā hana maʻamau.
Nā Hoʻohana Hoʻohanaʻia
"Hoʻololiʻana i kēia mau kumuʻo Tungsten," wahi a Horoshi Tanita, nā mea hana hana ma ka mea hana loiloi Kyoto "Ke lawe nei mākou i nā lua he 20,000 i kēlā me kēia hoʻololi me ka loliʻole o nā mea hana Hss.ʻO ka hoʻolālāʻana o kā mākou mau iniha kahiko.
No ke aha e koho ai i kēia papa papa PCB Drill?
ʻO ka'ōlelo pololeiʻole: no ka pololeiʻo Laser-like me ka pololei i loko o ka interconnect kiʻekiʻe (HDI) papa.
E wikiwiki me kaʻole o ka kaumaha: Drill 0.3mm mau lua ma 400 mau lua / minutising me kaʻole o ka hoʻololiʻana i keʻano.
ʻO keʻano kūpono: nā hana me FR-4, Rogers, alumini, a me nā papa inoa o ke aniani.
ʻO ka hoʻolālā-hōʻoia-profal-profal: Mākaukau no nā huahana PCT hou aʻe e like me nā mea haʻahaʻa haʻahaʻa haʻahaʻa-haʻahaʻa.
Hopena
I kahiʻoihana kahi e hoʻoponopono ai nā micron a pau i ka loaʻaʻana o ka pōmaikaʻi a me ka hana,ʻo kēia kalepa turehuʻO nā papa papa PCB Drillʻoi aku ma mua o nā mea hana - he mea maikaʻi lākou. E ka hoʻohuiʻana i kaʻepekemaʻenehana me ka hoʻomaʻamaʻaʻana i kaʻenehana, nā mea hana e hoʻopili ai i nā mea hana e pana ai i nā palena o ka minitanization
Post Time: Mar-21-2025
